Method of manufacturing single-crystal film

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156617R, 156DIG80, 156DIG111, C30B 2504

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active

044989512

ABSTRACT:
The whole surface of a polycrystalline or amorphous semiconductor film deposited so as to continuously cover the surface of a single-crystal substrate and an insulating film is irradiated with a laser beam or electron beam, thereby to selectively melt only those parts of the polycrystalline or amorphous semiconductor film which overlie the insulating film. Thus, a single-crystal semiconductor film is formed only the insular insulating film formed on the single-crystal substrate.

REFERENCES:
patent: 4174217 (1979-11-01), Flatley
patent: 4292091 (1981-09-01), Togei
patent: 4308078 (1981-12-01), Cook
patent: 4323417 (1982-04-01), Lam
patent: 4330363 (1982-05-01), Biecesen et al.
patent: 4338139 (1982-07-01), Shinada
patent: 4377031 (1983-03-01), Goto et al.
H. W. Lam et al., Single Crystal Silicon-On-Oxide by a Scanning CW Laser Induced Lateral Seeding Process, J. Electrochemical Soc. Solid-State Science and Technology, Sep. 1981, pp. 1981-1986.

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