Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2006-05-31
2009-12-29
Landau, Matthew C (Department: 2813)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C977S762000, C977S778000, C977S780000, C977S784000, C977S785000, C977S932000, C977S949000, C257SE51026, C257SE33054
Reexamination Certificate
active
07638345
ABSTRACT:
A method of manufacturing silicon nanowires is characterized in that silicon nanowires are formed and grown through a solid-liquid-solid process or a vapor-liquid-solid process using a porous glass template having nanopores doped with erbium or an erbium precursor. In addition, a device including silicon nanowires formed using the above exemplary method according to the present invention can be effectively applied to various devices, for example, electronic devices such as field effect transistors, sensors, photodetectors, light emitting diodes, laser diodes, etc.
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Cho Kyung Sang
Choi Byoung Lyong
Kwon Soon Jae
Lee Eun Kyung
Lee Jae Ho
Cantor & Colburn LLP
Landau Matthew C
Malek Maliheh
Samsung Electronics Co,. Ltd.
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