Method of manufacturing sharp waveguide branches in integrated o

Details Method of manufacturing sharp waveguide branches in integrated o Method of manufacturing sharp waveguide branches in integrated o

1993-11-19

1994-11-15

Powell, William

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156649, 156651, 156657, 1566611, 156662, H01L 21306, B44C 122, C03C 1500

Patent

active

053644956

ABSTRACT:
To manufacture a channel-type waveguide pattern (1.1) having Y-shaped branches and a sharp vertex (V) on or in a substrate (1), masks (6 and 7) which partially overlap one another are used for two different etching steps, which successively define a part of the Y-shaped pattern. In this process, use is made of only one auxiliary mask layer (2) made of suitably chosen material which can be etched in the first etching step but is resistant in a second etching step involving dry etching.

REFERENCES:
patent: 4938841 (1990-07-01), Shahar et al.
patent: 5032219 (1991-07-01), Buchmann et al.
patent: 5271801 (1993-12-01), Valette
Y. Shani et al, "Buried Rib Passive Waveguide Y Junctions with Sharp Vertex on INP", Mar. 1991, pp. 210-212, IEEE Photonics Technology Letters, vol. 3, No. 3.
E. C. M. Pennings, et al, "Ultracompact, Low-Loss Directional Couplers on InP Based on Self-Imaging by Multimode Interference", Oct. 14, 1991, pp. 1926-1928, Applied Physics Letters, No. 16.
U. Niggebrugge, et al, "A Novel Process for Reactive Ion Etching on InP, Using CH.sub.4 /H.sub.2 ", 1985, pp. 367-372 and title page, Institute Phys. Conf.
H. W. Lehmann, et al, "Profile Control by Reactive Sputter Etching", Mar./Apr. 1978, pp. 319-326, J. Vac. Sci. Technol.

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