Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1985-08-27
1987-05-05
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156345, 156640, 156644, 156651, 156656, 1566611, 20412955, 313403, 428596, 430 23, C23F 102, B44C 122, C03C 1500, C03C 2506
Patent
active
046629840
ABSTRACT:
A method of perforating through pores by etching in the manufacture of a shadow mask. This perforating method comprises the steps of selectively covering both surfaces of a thin metal plate with etching resistant film except a predetermined pore region; performing an etching to form recesses on the opening region of one surface of the metal plate; covering the one surface of the metal plate with an etching resistance material; etching the opening region of the other surface of the metal plate until the bottom of the etching resistance material buried in the recesses of the one surface of the metal plate is exposed; exposing both surfaces of the metal plate including the through holes by removing the etching resistant film and the etching resistant material; and etching the exposed surfaces of the metal plate again by contacting the exposed surface with an etchant.
REFERENCES:
patent: 2226383 (1940-12-01), Norris
patent: 2961314 (1960-11-01), Amdursky et al.
patent: 4013498 (1977-03-01), Frantzen et al.
patent: 4069085 (1978-01-01), Buysman et al.
patent: 4124437 (1978-11-01), Bond et al.
patent: 4357196 (1982-11-01), Tanaka et al.
patent: 4425183 (1984-01-01), Maheras et al.
Kudou Makoto
Ohtake Yasuhisa
Sengoku Yasushi
Kabushiki Kaisha Toshiba
Powell William A.
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