Method of manufacturing semiconductor wafers

Details Method of manufacturing semiconductor wafers Method of manufacturing semiconductor wafers

1996-12-12

1998-10-13

Niebling, John

Semiconductor device manufacturing: process

Chemical etching

Combined with the removal of material by nonchemical means

438692, H01L 21302

Patent

active

058211667

ABSTRACT:
method of manufacturing semiconductor wafers, which can prevent the pendent surface phenomenon during the mirror polishing of the wafers and can enhance the flatness of the mirror polished surfaces. The method of manufacturing semiconductor wafers according to this invention includes slicing ingots into wafers, chamfering the peripheral edge portions of the wafers, lapping the sliced surfaces of the wafers, grinding the lapped surfaces of the wafers to form a gradual concave shape, mirror polishing the ground surfaces of the wafers, and finally cleaning the mirror polished wafers.

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patent: 5043044 (1991-08-01), Hattori et al.
patent: 5400548 (1995-03-01), Huber et al.
patent: 5429711 (1995-07-01), Watanabe et al.
patent: 5447890 (1995-09-01), Kato et al.
patent: 5516706 (1996-05-01), Kusakabe
patent: 5679212 (1997-10-01), Kato et al.

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