Method of manufacturing semiconductor probe having resistive...

Details Method of manufacturing semiconductor probe having resistive... Method of manufacturing semiconductor probe having resistive...

2005-08-29

2008-09-02

Nguyen, Tuan H (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

C438S052000, C438S020000, C438S738000

Reexamination Certificate

active

07419843

ABSTRACT:
A method of manufacturing a semiconductor probe having a resistive tip. The method includes forming first and second mask films having a rectangular shape on a silicon substrate, first etching an upper surface of the silicon substrate, forming a third mask film corresponding to a width of a tip neck by etching the first mask film, forming the width of the tip neck to a predetermined width by second etching of the silicon substrate using the third mask film as a mask, and forming a peak forming portion of the tip by annealing the silicon substrate after removing the third mask film. A semiconductor probe having a uniform height and tips having a uniform neck width can be manufactured.

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