Method of manufacturing semiconductor package

Details Method of manufacturing semiconductor package Method of manufacturing semiconductor package

2010-09-01

2011-11-01

Stark, Jarrett (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S455000, C438S459000, C438S598000, C438S622000, C438S677000, C257SE21585, C257SE21599

Reexamination Certificate

active

08048804

ABSTRACT:
A method of manufacturing a semiconductor package, including at least a step A that forms a first transforming portion by irradiating a laser beam on at least a portion of a first substrate; a step B that joins together the first substrate and a second substrate in which a functional element is disposed; a step C that removes the first transforming portion that is disposed on the first substrate by etching; and a step D that forms a conductive portion in the first substrate by filling a conductive material in a portion where the first transforming portion has been removed.

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