Method of manufacturing semiconductor package

Details Method of manufacturing semiconductor package Method of manufacturing semiconductor package

1992-03-30

1993-04-06

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

165803, 165185, 361387, 361388, 257712, H05K 334

Patent

active

051991640

ABSTRACT:
The present invention relates to a semiconductor package which is loaded with a plurality of high-performance integrated circuits for high-performance systems such as super computers and large-sized computers. According to the invention, the packaging density of the semiconductor is doubled by stacking upper and lower members and forming substrates loaded with a plurality of chips in a multistep structure so that the size of computers can be minimized and heat emission efficiency can be improved by forming heat sinks in a fin-pin shape.

REFERENCES:
patent: 4561011 (1985-12-01), Kohara et al.
patent: 4654966 (1987-04-01), Kohara et al.
patent: 4716498 (1987-12-01), Ellis
patent: 4771365 (1988-09-01), Cichocki et al.
patent: 4867235 (1989-09-01), Grapes et al.
patent: 5097318 (1992-03-01), Tanaka et al.

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