Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2001-02-15
2004-03-23
Whitehead, Jr., Carl (Department: 2813)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C257S728000, C257S777000
Reexamination Certificate
active
06709890
ABSTRACT:
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a semiconductor manufacturing technique, and more particularly to an effective technique which is applicable to solder connection during semiconductor pellet mounting in an assembly of a high frequency module (a high frequency power amplifier).
BACKGROUND OF THE INVENTION
For example, Japanese Patent Laid-Open Publication No. 11-121921 (Machida et al.) has described a technique for a solder connecting method to be used when a semiconductor pellet is to be mounted on a board, wherein the back side on which the semiconductor pellet is mounted is supported by a frog-shaped pin during reflow step (solder connection).
Moreover, A high frequency power amplifier referred to as a high frequency module (also referred to as an RF module) has been known as a semiconductor integrated circuit device in which surface mounting type electronic parts such as a chip capacitor or a chip resistor and a semiconductor pellet for bare chip mounting are mounted on a printed circuit board and are thus assembled.
In the reflow mounting of the electronic parts and the semiconductor pellet in the assembly of the high frequency module on the printed circuit board, however, a void is generated in a solder connecting portion of the semiconductor pellet. As a result, detective solder connection is caused.
Furthermore, the semiconductor pellet is inclined and mounted during the solder connection. As a result, a height of a pad to be a surface electrode of the semiconductor pellet becomes nonuniform. Consequently, there is a problem in that bonding failures are caused during wire bonding.
SUMMARY OF THE INVENTION
It is an object of the present invention to provide a method of manufacturing a semiconductor integrated circuit device which can enhance connecting reliability of a solder connecting portion by removing a void formed in the solder connecting portion.
It is another object of the present invention to provide a method of manufacturing a semiconductor integrated circuit device which can enhance a degree of mounting horizontality for a printed circuit board of a semiconductor pellet.
Furthermore, it is yet another object of the present invention to provide a method of manufacturing a semiconductor integrated circuit device which can prevent a bad influence on wire bonding by removing soldering foreign substances scattered through melting.
It is a further object of the present invention to provide a method of manufacturing a semiconductor integrated circuit device which can reduce a thermal stress applied on the semiconductor integrated circuit device by collectively carrying out reflowing on the semiconductor pellet and surface mounting type electronic parts.
It is a further object of the present invention to provide a method of manufacturing a semiconductor integrated circuit device which can collectively carry out reflowing on the semiconductor pellet and the surface mounting type electronic parts, thereby simplifying the reflow step.
The present invention provides a method of manufacturing a semiconductor integrated circuit device, wherein a wiring board, a surface mounting type electronic part and a semiconductor pellet to be bare chip mounted are soldered to mount the electronic part and the semiconductor pellet on the wiring board, thereby carrying out an assembly, the method comprising the steps of providing the electronic part and the semiconductor pellet on the wiring board, heating and melting a connecting solder provided between the semiconductor pellet and the wiring board while pressurizing the semiconductor pellet against the wiring board in a heating portion capable of carrying out solder melting, and cooling a soldering portion of the semiconductor pellet and the wiring board to solder the wiring board, the electronic part and the semiconductor pellet with the semiconductor pellet pressurized against the wiring board in the heating portion.
In the method of manufacturing a semiconductor integrated circuit device according to the present invention, when the solder connecting portion is to be cooled in the heating portion, the wiring board is separated from a heat block provided in the heating portion, thereby cooling the soldering portion.
In the method of manufacturing a semiconductor integrated circuit device according to the present invention, when the amount of the pressurization of the semiconductor pellet is to be changed during the heating and melting operation of the connecting solder, the pressurization is carried out and is not carried out repeatedly so as to change the amount of the pressurization.
According to the present invention, the soldering portion is cooled with the semiconductor pellet pressurized against the wiring board. Consequently, the cooling can be carried out with the soldering portion pressurized.
Accordingly, the generation of a void in the soldering portion can be prevented. As a result, the connecting reliability of the soldering portion can be enhanced.
Furthermore, the soldering portion is cooled with the semiconductor pellet pressurized against the wiring board. Consequently, the semiconductor pellet can be mounted horizontally on the wiring board. As a result, a degree of mounting horizontality of the semiconductor pellet can be enhanced.
Accordingly, bonding precision can be enhanced during wire bonding. As a result, bonding failures can be reduced.
In the heating portion, moreover, the soldering portion is cooled with the semiconductor pellet pressurized against the wiring board. Consequently, the soldering portion can be cooled in the heating place. Consequently, a cooling region can be decreased.
As a result, the size of a reflow device can be reduced so that a space can be saved.
Furthermore, the present invention provides a method of manufacturing a semiconductor integrated circuit device, wherein a wiring board, a surface mounting type electronic part and a semiconductor pellet to be bare chip mounted are soldered to mount the electronic part and the semiconductor pellet on the wiring board, thereby carrying out an assembly, the method comprising the steps of providing the electronic part and the semiconductor pellet on the wiring board, heating and melting a connecting solder provided between the semiconductor pellet and the wiring board while pressurizing the semiconductor pellet against the wiring board in a heating portion capable of carrying out solder melting, and changing an amount of the pressurization during the heating and melting, and cooling a soldering portion of the semiconductor pellet and the wiring board to solder the wiring board, the electronic part and the semiconductor pellet.
According to the present invention, the amount of the pressurization through the semiconductor pellet is changed during the heating and melting. Consequently, a pressure to be applied to the soldering portion during the melting is varied. Thus, a kinetic energy can be given to air in a void formed in the soldering portion.
As a result, the kinetic energy of the air in the void is activated and the soldering portion is pressurized. Consequently, the void can be pushed out.
Accordingly, the generation of a void in the soldering portion can be prevented. As a result, the connecting reliability of the soldering portion can be enhanced.
Moreover, the present invention provides a method of manufacturing a semiconductor integrated circuit device, wherein a wiring board, a surface mounting type electronic part and a semiconductor pellet to be bare chip mounted are soldered to mount the electronic part and the semiconductor pellet on the wiring board, thereby carrying out an assembly, the method comprising the steps of providing the electronic part and the semiconductor pellet on the wiring board, heating and melting a connecting solder provided between the semiconductor pellet and the wiring board while pressurizing the semiconductor pellet against the wiring board in a heating portion capable of carrying out solder melting, cooling a soldering portion of the semiconductor pellet and the wiring bo
Hagiwara Isao
Hashizume Masakazu
Ida Tsutomu
Ishizu Akio
Shiokawa Yoshinori
Antonelli Terry Stout & Kraus LLP
Berezny Nema
Jr. Carl Whitehead
Renesas Technology Corporation
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