Method of manufacturing semiconductor devices

Details Method of manufacturing semiconductor devices Method of manufacturing semiconductor devices

2011-03-22

2011-03-22

Pham, Thanhha (Department: 2894)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S613000, C257SE21575

Reexamination Certificate

active

07910478

ABSTRACT:
A method of manufacturing a semiconductor device, forms connection pads electrically connected to integrated circuit portion formed in a semiconductor substrate, lays an insulating film and a protective film one over another, forms sub-lines electrically connected to the connection pads on the protective film, forms a coating film covering the sub-lines and the protective film, sticks a dry film onto the coating film, forms external connection electrodes externally connectable and electrically connected to the sub-lines, and removes the dry film and forms a sealing layer covering the coating film and side surfaces of the external connection electrodes.

REFERENCES:
patent: 2005/0239277 (2005-10-01), Mercer et al.
patent: 2008-084919 (2008-04-01), None
patent: 2008-244383 (2008-10-01), None

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