Method of manufacturing semiconductor device using precision pol

Details Method of manufacturing semiconductor device using precision pol Method of manufacturing semiconductor device using precision pol

1999-05-03

2000-12-26

Eley, Timothy V.

Abrading

Precision device or process - or with condition responsive...

With indicating

438692, 438693, 451 41, 451 54, 451 66, 451 57, 451288, B24B 4900

Patent

active

061650501

ABSTRACT:
In order to reclaim defective articles, wafers carried in from a loading unit are transported to a wafer stocker unit, a polishing unit, a pre-rinsing unit, a rinsing unit, a spin dehydrating unit and a drying unit in the named order, and in a defect inspecting device, defective articles are sorted and the remainder are taken out of an unloading unit as products. The defective articles are classified in a discriminating device in conformity with the kinds of defects and are returned to the polishing unit, the rinsing unit or the drying unit through a return duct.

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