Method of manufacturing semiconductor device that uses both...

Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S617000, C438S926000, C257SE21523

Reexamination Certificate

active

08084279

ABSTRACT:
According to one embodiment of the present invention, a method of manufacturing a semiconductor device includes below steps. A step of preparing a phase shift mask and a normal photomask. A step of stacking a first wiring layer on a semiconductor substrate, and further stacking, on the first wiring layer, a second wiring layer. The second wiring layer includes a second wiring and third wiring. A step of stacking an interlayer insulating film on the second wiring layer. A step of forming, in the interlayer insulating film, a first opening in which the second wiring is exposed, and a second opening in which the third wiring is exposed by photolithography using the normal photomask. A step of burying a metal in the first opening and the second opening. A step of providing a pad to be overlaid on the first and second openings.

REFERENCES:
patent: 5879839 (1999-03-01), Jung et al.
patent: 5998068 (1999-12-01), Matsuoka
patent: 6333213 (2001-12-01), Hasebe et al.
patent: 6660462 (2003-12-01), Fukuda
patent: 6897669 (2005-05-01), Ishio et al.
patent: 6902852 (2005-06-01), Watanabe
patent: 7115985 (2006-10-01), Antol et al.
patent: 7271013 (2007-09-01), Yong et al.
patent: 7397127 (2008-07-01), Lin et al.
patent: 7701072 (2010-04-01), Nishida
patent: 2005/0173801 (2005-08-01), Mimura et al.
patent: 2005/0255387 (2005-11-01), Butt et al.
patent: 2006/0125118 (2006-06-01), Yamazaki
patent: 6-282063 (1994-10-01), None
patent: 8-306615 (1996-11-01), None
patent: 9-179287 (1997-07-01), None
patent: 10-73914 (1998-03-01), None
patent: 10-83062 (1998-03-01), None
patent: 10-178015 (1998-06-01), None
patent: 11-307601 (1999-11-01), None
patent: 2003-114514 (2003-04-01), None
patent: 2003-114516 (2003-04-01), None
patent: 2004-134450 (2004-04-01), None
patent: 2004-158833 (2004-06-01), None
patent: 2005-25230 (2005-01-01), None
patent: 2005-116562 (2005-04-01), None
patent: 2005-183407 (2005-07-01), None
patent: 2006-5202 (2006-01-01), None
patent: 2006-165419 (2006-06-01), None
patent: 2006-339406 (2006-12-01), None
patent: WO 2005/083767 (2005-09-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing semiconductor device that uses both... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing semiconductor device that uses both..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing semiconductor device that uses both... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4254458

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.