Method of manufacturing semiconductor device including...

Details Method of manufacturing semiconductor device including... Method of manufacturing semiconductor device including...

2011-08-09

2011-08-09

Arora, Ajay K (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C257S620000, C257SE21596, C257SE21599, C438S068000, C438S114000, C438S458000

Reexamination Certificate

active

07993975

ABSTRACT:
A semiconductor-device manufacturing method includes: forming terminals on a wafer and across each of dicing lines along which the wafer is cut into a plurality of semiconductor chips; preparing a plurality of pre-cut substrates each including a substrate body capable of being cut along corresponding one of cutting lines into a pair of same structured substrate pieces, connection pads provided on a top surface of the substrate body, and external terminals formed on a bottom surface of the substrate body and connected to the connection pads; mounting the pre-cut substrates onto the wafer while the cutting lines of the pre-cut substrates match the dicing lines; and simultaneously dicing the wafer and the pre-cut substrates along the dicing lines matching the cutting lines.

REFERENCES:
patent: 2002/0039807 (2002-04-01), Koyama
patent: 2002/0081771 (2002-06-01), Ding et al.
patent: 2005/0009245 (2005-01-01), Farnworth
patent: 2005/0131106 (2005-06-01), Tonapi et al.
patent: 09-260536 (1997-10-01), None
patent: 2002-110856 (2002-04-01), None
patent: 2006-216823 (2006-08-01), None
Daily, James W. Packaging of Electronic Systems—A Mechanical Engineering Approach. McGraw Hill, 1990, pp. 113-115.

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