Method of manufacturing semiconductor device having a test pad

Details Method of manufacturing semiconductor device having a test pad Method of manufacturing semiconductor device having a test pad

1997-10-10

1999-12-28

Dutton, Brian

Semiconductor device manufacturing: process

With measuring or testing

Electrical characteristic sensed

324754, H01L 2166, G01R 3126

Patent

active

060080612

ABSTRACT:
A method for manufacturing a surface mounting type semiconductor device, to prevent a bump from forming on a test pad, by contacting with a probe needle at a die sort test in manufacturing a surface mounting type semiconductor device. A test pad is formed with a layer, made of the same components as a bonding pad, above the major surface of semiconductor substrate, where an IC is formed. A probe needle is applied onto the test pad to carry out a die sort test. Subsequently, for a conforming article, a resist film is patterned by a lithography technique, thus removing only the test pad. A bump is normally formed only on the remaining bonding pad, thereby avoiding a continuity failure at assembly and any unexpected short-circuits during the connection with the wiring.

REFERENCES:
patent: 4104785 (1978-08-01), Shiba et al.
patent: 4628590 (1986-12-01), Udo et al.
patent: 5654206 (1997-08-01), Merrill
patent: 5886414 (1999-03-01), Galloway
patent: 5899703 (1999-05-01), Kalter et al.

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