Method of manufacturing semiconductor device and support...

Details Method of manufacturing semiconductor device and support... Method of manufacturing semiconductor device and support...

2006-01-20

2008-12-02

Malsawma, Lex (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S458000, C438S459000

Reexamination Certificate

active

07459343

ABSTRACT:
A method of manufacturing a semiconductor device is disclosed. The method comprises a first step of grinding a second principle surface of a semiconductor substrate opposite to a first principle surface of the semiconductor substrate on which semiconductor device elements are formed, a second step of attaching a support structure configured to support the semiconductor substrate to the second principle surface after the first step, and a third step of detaching the semiconductor substrate from the support structure.

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patent: 2003-324142 (2003-11-01), None
Notification of the First Office Action dated Jan. 4, 2008 for the corresponding CN200510071370.5.

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