Method of manufacturing semiconductor device and cleaning...

Details Method of manufacturing semiconductor device and cleaning... Method of manufacturing semiconductor device and cleaning...

2006-09-14

2009-12-22

Sefer, A. (Department: 2893)

Semiconductor device manufacturing: process

With measuring or testing

Electrical characteristic sensed

C438S043000, C438S638000, C438S639000, C438S640000, C257S774000, C257SE21218, C257SE21219, C257SE21224

Reexamination Certificate

active

07635601

ABSTRACT:
The disclosure concerns a manufacturing method of a semiconductor device includes dry-etching a semiconductor substrate or a structure formed on the semiconductor substrate; supplying a solution onto the semiconductor substrate; measuring a specific resistance or a conductivity of the supplied solution; and supplying a removal solution for removing the etching residual material onto the semiconductor substrate for a predetermined period of time based on the specific resistance or the conductivity of the solution, when an etching residual material adhering to the semiconductor substrate or the structure is removed.

REFERENCES:
patent: 5650041 (1997-07-01), Gotoh et al.
patent: 6080529 (2000-06-01), Ye et al.
patent: 6194326 (2001-02-01), Gilton
patent: 2004/0035448 (2004-02-01), Aegerter et al.
patent: 2004/0082491 (2004-04-01), Olson et al.
patent: 2004/0137736 (2004-07-01), Daviot et al.
patent: 07-193045 (1995-07-01), None
patent: 2001308063 (2001-11-01), None
patent: 2003-151950 (2003-02-01), None
patent: 2003-151950 (2003-05-01), None

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