Method of manufacturing semiconductor device

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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Details

156645, 156646, 156657, 1566591, 156662, H01L 21306

Patent

active

043115462

ABSTRACT:
A method of surface treatment of a layer grown on a semiconductor substrate by chemical vapor deposition technique for removing a projection appearing on the layer comprises the steps of forming a layer on the semiconductor substrate by chemical vapor deposition technique, forming a membrane of plastic material that resists etching on the layer, pressing a flat plate against the plastic membrane on a projection of the layer to expose the projection, and etching the projection.

REFERENCES:
patent: 3234058 (1966-02-01), Marinace
patent: 3506506 (1970-04-01), Pennebaker
patent: 3518131 (1970-06-01), Glendinning
patent: 3718514 (1973-02-01), Erdman et al.
patent: 3982976 (1976-09-01), Marciniec
patent: 3990925 (1976-11-01), Erdman et al.

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