Method of manufacturing semiconductor device

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438743, 438744, 216 74, H01L 2100

Patent

active

059942274

ABSTRACT:
An improved etching method allowing the formation of a silicon nitride film with an adequate film thickness at the sidewall portion of a pattern is disclosed. A silicon nitride film formed to cover a stepped pattern is dry-etched, employing plasma of mixed gases containing CH.sub.2 F.sub.2 and O.sub.2. As a result, a sidewall spacer of the silicon nitride film is formed at the sidewall of the pattern in a self-aligned manner.

REFERENCES:
patent: 5286344 (1994-02-01), Blalock et al.
patent: 5462896 (1995-10-01), Komura et al.
patent: 5726100 (1998-03-01), Givens

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1671944

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.