Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
Patent
1998-07-20
1999-11-30
Breneman, Bruce
Semiconductor device manufacturing: process
Chemical etching
Combined with coating step
438743, 438744, 216 74, H01L 2100
Patent
active
059942274
ABSTRACT:
An improved etching method allowing the formation of a silicon nitride film with an adequate film thickness at the sidewall portion of a pattern is disclosed. A silicon nitride film formed to cover a stepped pattern is dry-etched, employing plasma of mixed gases containing CH.sub.2 F.sub.2 and O.sub.2. As a result, a sidewall spacer of the silicon nitride film is formed at the sidewall of the pattern in a self-aligned manner.
REFERENCES:
patent: 5286344 (1994-02-01), Blalock et al.
patent: 5462896 (1995-10-01), Komura et al.
patent: 5726100 (1998-03-01), Givens
Inoue Shinya
Maeda Kiyoshi
Matsuo Hiroshi
Oda Takuji
Yamamoto Yuji
Breneman Bruce
Mitsubishi Denki & Kabushiki Kaisha
Powell Alva C.
Ryoden Semiconductor System Engineering Corporation
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