Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Reexamination Certificate
2006-09-06
2010-12-14
Davis, Daborah Chacko (Department: 1795)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
C430S311000, C430S323000
Reexamination Certificate
active
07851137
ABSTRACT:
There are provided a semiconductor device manufacturing method including: forming a film to be processed above a substrate; forming a resist layer above the film to be processed; transferring a transfer pattern to the resist layer using a reticle including the transfer pattern having a space having a width that becomes narrower than a smallest processing space width when transferred to the resist layer; performing trimming processing on the resist layer including the transfer pattern as transferred; and patterning the film to be processed using the resist layer, on which the trimming processing has been performed, as a mask.
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Notification of Reasons for Rejection issued by the Japanese Patent Office on Aug. 13, 2010, for Japanese Patent Application No. 2005-285155, and English-language translation thereof.
Chacko Davis Daborah
Finnegan Henderson Farabow Garrett & Dunner L.L.P.
Kabushiki Kaisha Toshiba
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