Method of manufacturing semiconductor device

Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Ion implantation of dopant into semiconductor region

Reexamination Certificate

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Details

C438S520000, C438S521000, C438S529000, C257SE21002

Reexamination Certificate

active

07598162

ABSTRACT:
It is an object to provide a method of manufacturing a semiconductor device capable of forming a MOS transistor of high performance, comprising the steps of forming a gate electrode on a semiconductor substrate via a gate-insulating film (step S1), introducing a impurity into the semiconductor substrate using the gate electrode as a mask (step S7), introducing a diffusion-controlling substance into the semiconductor substrate to control the diffusion of the impurity (step S8), forming a side wall-insulating film on each side surface of the gate electrode (step S9), deeply introducing impurity into the semiconductor substrate using the gate electrode and the side wall-insulating film as masks (step S10), activating the impurity by the annealing treatment using a rapid thermal annealing method (step S11), and further activating the impurity by the millisecond annealing treatment (step S12).

REFERENCES:
patent: RE37158 (2001-05-01), Lee
patent: 6391731 (2002-05-01), Chong et al.
patent: 6770519 (2004-08-01), Ito et al.
patent: 6897118 (2005-05-01), Poon et al.
patent: 7432146 (2008-10-01), Tomonari
patent: 2004/0004250 (2004-01-01), Momiyama et al.
patent: 2001-0065303 (2001-07-01), None
patent: 2004-0010366 (2004-01-01), None

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