Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2006-12-08
2009-08-11
Everhart, Caridad M (Department: 2895)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S702000, C438S733000, C257SE21490, C257SE21584
Reexamination Certificate
active
07572729
ABSTRACT:
A method of manufacturing semiconductor devices, including the steps of forming an insulating layer on a semiconductor substrate in which predetermined structures are formed, and etching the insulating layer to expose a predetermined region of the semiconductor substrate, thereby forming a contact hole, forming an insulating layer on the sides of the contact hole, and forming a conductive layer within the contact hole, forming a contact plug. It is possible to prevent a short problem by sufficiently securing a distance between a drain contact plug and a virtual power line.
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Everhart Caridad M
Hynix / Semiconductor Inc.
Marshall & Gerstein & Borun LLP
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