Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-02-20
2007-02-20
Booth, Richard A. (Department: 2812)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S695000, C438S697000
Reexamination Certificate
active
10743578
ABSTRACT:
Provided is a method of manufacturing a semiconductor device. According to the present invention, it is possible that an interlayer insulating film is planarized by forming the interlayer insulating film using multiple simultaneous deposition-and-etch processes without carrying out a subsequent planarization process. In addition, smoothness can be variably controlled by adjusting the deposition and etch rate.
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Booth Richard A.
Marshall & Gerstein & Borun LLP
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