Method of manufacturing semiconductor device

Details Method of manufacturing semiconductor device Method of manufacturing semiconductor device

2006-01-17

2006-01-17

Sarkar, Asok Kumar (Department: 2829)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S122000, C438S124000, C438S127000

Reexamination Certificate

active

06987030

ABSTRACT:
The method of manufacturing the semiconductor device includes the steps of forming terminal portions convexly protruding on a surface of first conductive foil by etching the first conductive foil except portions to become terminals, superimposing a resin sheet on the first conductive foil such that the terminal portions are embedded in the resin sheet, constructing a laminated sheet by superimposing second conductive foil having a resin layer formed on a back thereof, on the resin sheet with the resin layer faced down, forming a conductive pattern by etching the second conductive foil, electrically connecting the conductive pattern and the terminal portions, electrically isolating the terminal portions from each other, firmly fixing a semiconductor element to the laminated sheet and electrically connecting the semiconductor element and the conductive pattern, and forming sealing resin on a surface of the laminated sheet such that the semiconductor element is covered by the sealing resin.

REFERENCES:
patent: 5424250 (1995-06-01), Sawada
patent: 6352879 (2002-03-01), Fukui et al.
patent: 6475629 (2002-11-01), Takeuchi et al.
patent: 6562660 (2003-05-01), Sakamoto et al.

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