Method of manufacturing semiconductor device

Details Method of manufacturing semiconductor device Method of manufacturing semiconductor device

1986-08-25

1988-08-16

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

174 52FP, 2281802, 357 70, 437 8, H01R 4300

Patent

active

047634090

ABSTRACT:
A method of manufacturing a semiconductor device employing a film carrier tape during process steps thereof is disclosed. Any test pad is not provided in the film carrier tape. Therefore, the semiconductor element carried in the film is cut at the leads and separated from the film carrier tape without conducting any electrical test. The separated semiconductor element is conducted the electrical test by installing it on a testing substrate which is provided to adapt to a large number of terminals.

REFERENCES:
patent: 2795043 (1974-03-01), Forlani
patent: 3678385 (1972-07-01), Bruner
patent: 3777365 (1973-12-01), Umbaugh
patent: 3793719 (1974-02-01), Bylander
patent: 3838984 (1974-10-01), Crane et al.
patent: 3859718 (1975-01-01), Noe
patent: 4026008 (1977-05-01), Drees et al.
patent: 4411719 (1983-10-01), Lindberg

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