Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate
2011-08-23
2011-08-23
Le, Dung A. (Department: 2818)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
C438S779000, C438S782000, C438S783000, C438S508000
Reexamination Certificate
active
08003547
ABSTRACT:
A substrate processing apparatus, a method of manufacturing a semiconductor device, and a method of confirming an operation of a liquid flowrate control device are provided. The substrate processing apparatus comprises: a process chamber accommodating a substrate; a liquid source supply system supplying a liquid source into the process chamber; a solvent supply system supplying a solvent having a vapor pressure greater than that of the liquid source into the process chamber; a liquid flowrate control device controlling flowrates of the liquid source and the solvent; and a controller controlling the liquid source supply system, the solvent supply system, and the liquid flowrate control device so that the solvent is supplied into the liquid flowrate control device than the solvent supply system to confirm an operation of the liquid flowrate control device before the liquid source supply system supplies the liquid source into the process chamber.
REFERENCES:
patent: 6008143 (1999-12-01), Yu et al.
patent: 2009/0061648 (2009-03-01), Horii et al.
patent: 09-186107 (1997-07-01), None
patent: 2007-109865 (2007-04-01), None
Brundidge & Stanger, P.C.
Hitachi Kokusai Electric Inc.
Le Dung A.
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