Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate
2011-08-09
2011-08-09
Menz, Laura M (Department: 2813)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
C438S689000, C438S690000
Reexamination Certificate
active
07994021
ABSTRACT:
A method of forming a semiconductor device is provided, including a step of forming a layer which absorbs light over one face of a first substrate, a step of providing a second substrate over the layer which absorbs light, a step of providing a mask to oppose the other face of the first substrate, and a step of transferring the part of the layer which absorbs light to the second substrate by irradiating the layer which absorbs light with a laser beam through the mask.
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Higa Eiji
Miyairi Hidekazu
Moriwaka Tomoaki
Shimomura Akihisa
Shoji Hironobu
Hush Blackwell LLP
Menz Laura M
Semiconductor Energy Laboratory Co,. Ltd.
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