Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Reexamination Certificate
1998-04-06
2002-04-16
Chaudhuri, Olik (Department: 2814)
Semiconductor device manufacturing: process
With measuring or testing
Packaging or treatment of packaged semiconductor
C438S110000, C438S112000, C438S123000
Reexamination Certificate
active
06372526
ABSTRACT:
BACKGROUND OF THE INVENTION
This invention relates, in general, to semiconductor components, and more particularly, to methods of manufacturing semiconductor components.
After semiconductor devices are formed in a semiconductor wafer and after the wafer is singulated into individual semiconductor substrates or dice, the dice are assembled into packages or components. This assembly process includes, among other steps, attaching electrical leads to each of the dice and encapsulating each of the dice. However, the assembly process is very expensive and time consuming.
Accordingly, a need exists for an inexpensive and quick method of manufacturing semiconductor components.
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Bailey Keith W.
Darbha Sury N.
Lorenzen Gary R.
Mukerji Prosanto K.
Chambliss Alonzo
Chaudhuri Olik
Semiconductor Components Industries LLC
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