Method of manufacturing semiconductor apparatus

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257SE23078, C324S757020

Reexamination Certificate

active

07119362

ABSTRACT:
In an electric characteristic testing process corresponding to a process of the semiconductor apparatus manufacturing processes, in order to test a large area of the electrode pad of the body to be tested in a lump, an electric characteristic testing is performed by pressing a testing structure provided with electrically independent projections having a number equal to a number of conductor portions to be tested formed on an area to be tested of a body to be tested to the body to be tested.

REFERENCES:
patent: 5408190 (1995-04-01), Wood et al.
patent: 5679977 (1997-10-01), Khandros et al.
patent: 5917707 (1999-06-01), Khandros et al.
patent: 5931685 (1999-08-01), Hembree et al.
patent: 5986459 (1999-11-01), Fukaya et al.
patent: 6072323 (2000-06-01), Hembree et al.
patent: 6242803 (2001-06-01), Khandros et al.
patent: 6245444 (2001-06-01), Marcus et al.
patent: 6573743 (2003-06-01), Sato
patent: 1-147374 (1989-06-01), None
patent: 5-243344 (1993-09-01), None
patent: 6-123746 (1994-05-01), None
patent: 6-213930 (1994-08-01), None
patent: 6-230030 (1994-08-01), None
patent: 7-7052 (1995-01-01), None
patent: 8-50146 (1996-02-01), None
patent: 8-148533 (1996-06-01), None
patent: 9-148389 (1997-06-01), None
patent: 9-243663 (1997-09-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing semiconductor apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing semiconductor apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing semiconductor apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3666996

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.