Method of manufacturing radiating plate and semiconductor...

Details Method of manufacturing radiating plate and semiconductor... Method of manufacturing radiating plate and semiconductor...

2005-03-31

2008-11-04

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S118000, C257SE21519

Reexamination Certificate

active

07445965

ABSTRACT:
A method of manufacturing a radiating plate using In as a thermal conducting bonding material20provided between a semiconductor device and a radiating plate14and serving to bond a back surface of the semiconductor device to the radiating plate, includes the steps of carrying out a cleaning treatment for cleaning a surface of the radiating plate14, supplying the In to the radiating plate14, heating and melting the In and hermetically adhering the In18to the radiating plate, thereby obtaining an In integral type radiating plate.

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