Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1993-05-24
1994-04-12
Rodee, Christopher
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
430319, 156625, 156901, 427 96, 427 97, 427 98, 427306, G03F 736, B05D 300
Patent
active
053024923
ABSTRACT:
A method of manufacturing printed circuit boards is disclosed wherein metallic conductive structures are produced in a desired pattern on a carrier board of isolating material. The method begins with the provision of a carrier board having a metal foil laminated to its surface and thereafter forming conductive traces on the carrier board, deactivating the carrier board to remove substantially all substances deposited on the carrier board other than the conductive traces and forming final conductive structures by electroless chemical metal deposition on the pattern of conductive traces. Circuit boards manufactured in accordance with such a method will have final conductor structures with base layer portions of the original laminated metal foil. In a preferred embodiment, the step of deactivating the carrier board involves rinsing the carrier board with hydrochloric acid. The method can be used for manufacturing single-layer or multilayer printed circuit boards with or without through-holes and permits the formation of conductor structures in the range of 50 micrometers or less.
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Chumbres et al. "Landless Plated-Through Hole Photoresist Masking Process" vol. 15(10), 1973, pp. 3298-3299.
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Kornmayer Werner
Moser Michael
Motz Werner
Ott Albert
Duda Kathleen
Hewlett--Packard Company
Rodee Christopher
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