Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1983-10-27
1984-12-11
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29852, 156656, 1566591, 156666, 156 90Z, 204 15, 204 321, 427 97, C23F 102, C25D 502, C25D 534, B44C 122
Patent
active
044876548
ABSTRACT:
An improved method of manufacturing a printed wiring board having the characteristics of one with a solder mask over bare copper for circuit traces and ground planes. The method includes the step of electroplating a very thin coating of tin-lead over the circuit traces, ground planes, holes and circuit pads prior to selectively coating only the pads and holes with a relatively thick coating of tin-lead solder plate. After removing the plating resist which defines the areas for selective solder coating, the board is chemically etched and then mechanically scrubbed to roughen the surface of and reduce the thickness of the thin solder plate. A solder mask may be applied over circuit traces and ground planes prior to reflowing the thick coating of solder plate. Assembled printed wiring boards may then be wave soldered without wrinkling of the solder mask.
REFERENCES:
patent: 4104111 (1978-08-01), Mack
patent: 4325780 (1982-04-01), Schulz
Electronic Packaging and Production, Dec. 1982, Solder Coating and Leveling Competes with Tin-Lead Electroplate, H. W. Markstein, pp. 30-35.
Printed Circuit Fabrication, vol. 4, No. 8, Aug. 1981, Selective Solder Coating, C. R. Smith, Gyrex Corp., pp. 1-8.
Electronic Packaging and Production, Jan. 1979, PC Processing Using Solder Mask Over Tin-Nickel, E. F. Duffek, pp. 71-73.
Ael Microtel Limited
Cannon Russell A.
Powell William A.
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