Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1985-06-27
1986-08-12
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
29852, 156652, 156656, 1566591, 156902, 427 97, C23F 102, B44C 122, C03C 1500, C03C 2506
Patent
active
046054715
ABSTRACT:
A method of producing a printed circuit board comprising the steps of applying a layer of electrically conductive material on at least one side of a printed circuit board, cleaning the surface of the electrical conductive layer, printing a plating resist onto the layer so as to expose only the required trace area of an electrical circuit pattern, electroplating over the layer of electrically conductive material a layer of nickel metal which has a melting point sufficiently high to prevent movement in a molten state during a subsequent soldering operation, removing the plating resist by etching leaving a nickel layer on the trace areas of the circuit pattern, applying a solder resist to the layer so as to expose only the plated-through holes and other connecting sites of the board such as contact fingers and connecting pads, removing the nickel metal from the exposed area of the board, and applying a layer of sealant to retard copper oxidation and/or promote solderability of the exposed plated-through holes, the connecting pads and the contact fingers.
REFERENCES:
patent: 3704208 (1972-11-01), Russo
patent: 4024631 (1977-05-01), Castillero
patent: 4312897 (1982-01-01), Reimann
patent: 4325780 (1982-04-01), Schulz
patent: 4444619 (1984-04-01), O'Hara
patent: 4487654 (1984-12-01), Coppin
patent: 4525246 (1985-06-01), Needham
Hawk Jr. Wilbert
Lavin Richard W.
NCR Corporation
Powell William A.
Sessler Jr. Albert L.
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