Method of manufacturing printed circuit boards

Details Method of manufacturing printed circuit boards Method of manufacturing printed circuit boards

1983-06-03

1984-12-11

Newsome, John H.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

1566591, 1566611, 427 541, 427 96, 427270, B05D 306

Patent

active

044878281

ABSTRACT:
A method for manufacturing a printed wiring board having a solder layer existing on circuit paths located on surfaces of the board and a solder layer on the walls of thru holes located in the board involves coating the surface of the board with a layer of photopolymer resist. A shield is placed over selected areas of the solder layer on the surface and the shielded surface is exposed to ultra violet light until the unshielded resist hardens. The shielded resist which has remained soft is removed and the board is washed with solder resist to remove the solder layer not covered by a coating of hardened resist.

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Villanuci et al., "Electronic Techniques" Prentice-Hall Inc., Englewood Cliffs, N.J., pp. 283-293.

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