Method of manufacturing printed circuit boards

Details Method of manufacturing printed circuit boards Method of manufacturing printed circuit boards

1985-03-25

1986-07-01

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156646, 156655, 156656, 156668, 156902, 204192EC, 204192E, 427 96, B44C 122, C03C 1500, C23F 102, B29C 1708

Patent

active

045978280

ABSTRACT:
In order to enable fine traces to be obtained on printed circuit boards without excessive undercutting, while maintaining a high degree of adhesion, an unclad FRA board is provided with a surface butter coat which is etched to form a microporous surface layer. This layer is subjected to treatment in a plasma additively reactive with surface groups of the butter coat resin to provide modified groups promoting adherence to a thin metallization layer of vacuum deposited copper. The metallization layer is selectively electroplated to form the desired circuit pattern, and the unplated areas of the metallization layer are etched away.

REFERENCES:
patent: 4351697 (1982-09-01), Shanefield et al.
patent: 4389268 (1983-06-01), Oshima et al.
patent: 4424095 (1984-01-01), Frisch et al.
patent: 4536271 (1985-08-01), Collins

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