Method of manufacturing printed circuit board

Details Method of manufacturing printed circuit board Method of manufacturing printed circuit board

2008-02-01

2010-11-02

Walke, Amanda C. (Department: 1795)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S311000, C430S005000, C430S330000, C430S322000, C264S227000

Reexamination Certificate

active

07824838

ABSTRACT:
A method of manufacturing a printed circuit board is disclosed. The method includes: forming a relievo pattern and an intaglio pattern on a surface of a base plate; forming a metal plate, which has a metal pattern that corresponds with a shape of the relievo pattern and the intaglio pattern, by plating a surface of the relievo pattern and a surface of the intaglio pattern; separating the metal plate from the base plate; pressing the metal plate onto an insulation layer with the metal pattern facing the insulation layer; and removing a portion of the metal plate such that the metal pattern is exposed. Since this method does not use carriers, there is no need for a chemical etching process for carrier removal.

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