Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1992-06-19
1993-09-14
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
1566591, 156664, 156901, 29620, 20419232, C23F 100, B44C 122
Patent
active
052445364
ABSTRACT:
A method of manufacturing a platinum temperature sensor includes the step of obtaining a meandering resistive circuit by forming grooves in a platinum film which is provided on an insulating substrate. In order to provide a high resistance value by reducing the line width of the resistive circuit, as well as to miniaturize the platinum temperature sensor, this method comprises steps of forming a resist film on the platinum film provided on the insulating substrate, patterning the resist film by photolithography, and using the patterned resist film as a mask to finely work the platinum film by Ar.sup.+ ion etching for forming the grooves. Due to formation of such grooves, the platinum film defines a meandering pattern portion which provides the resistive circuit.
REFERENCES:
patent: 4248688 (1981-03-01), Gartner et al.
patent: 4624138 (1986-11-01), Ono et al.
patent: 4805296 (1989-02-01), Jinda et al.
Kubota Teppei
Miyagawa Kazuto
Tani Hiroji
Murata Manufacturing Co. Ltd.
Powell William A.
LandOfFree
Method of manufacturing platinum temperature sensor does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing platinum temperature sensor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing platinum temperature sensor will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2024034