Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Responsive to electromagnetic radiation
Reexamination Certificate
2004-09-29
2008-09-23
Baumeister, Bradley W. (Department: 2891)
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Responsive to electromagnetic radiation
C438S073000, C257SE27133, C257S466000
Reexamination Certificate
active
07427530
ABSTRACT:
Methods of manufacturing a photo diode include sequentially forming a buried layer of a first conductivity type, a first epitaxial layer of the first conductivity type, and a second epitaxial layer of a second conductivity type on a substrate. The second and first epitaxial layers are etched to form a trench that exposes a portion of the buried layer. A conductive plug of the first conductivity type is formed in the trench. A first electrode is formed on an upper surface of the second epitaxial layer. A second electrode may be formed to contact an upper surface of the conductive plug. Photodiodes having a conductive plug contact to a buried layer are also provided.
REFERENCES:
patent: 5886374 (1999-03-01), Sakamoto et al.
patent: 5973257 (1999-10-01), Cantarini et al.
patent: 6133615 (2000-10-01), Guckel et al.
patent: 6218719 (2001-04-01), Tsang
patent: 6534759 (2003-03-01), Koscielniak et al.
patent: 6538294 (2003-03-01), Sjodin et al.
patent: 6828644 (2004-12-01), Asano et al.
patent: 6930336 (2005-08-01), Merrill
patent: 2001/0010943 (2001-08-01), Tsang
patent: 2001/0042875 (2001-11-01), Yoshida
patent: 2002/0070417 (2002-06-01), Kimura et al.
patent: 1447445 (2003-10-01), None
patent: 61-133660 (1986-06-01), None
patent: 2000106453 (2000-04-01), None
patent: 2001-0111028 (2001-12-01), None
patent: 2002-0048342 (2002-06-01), None
patent: 2002-92415 (2002-12-01), None
Notice to Submit a Response for Korean patent application No. 10-2003-0079903 mailed on Aug. 17, 2006.
Copy of Chinese Office Action, including translation, Application No. 2004100104204, dated Mar. 21, 2008.
Bae Sung-ryoul
Nam Dong-kyun
Baumeister Bradley W.
Fulk Steven J
Myers Bigel & Sibley & Sajovec
Samsung Electronics Co,. Ltd.
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