Method of manufacturing multilayer circuit board

Details Method of manufacturing multilayer circuit board Method of manufacturing multilayer circuit board

1986-05-27

1988-06-21

Kittle, John E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430316, 430318, 430317, 430330, 427 98, 427103, 427 96, G03C 500, B05D 512

Patent

active

047525550

ABSTRACT:
A first conductor layer made of a thick film conductor is formed with a predetermined pattern on a substrate. A thick film resistor is then formed to be connected to the first conductor layer. An insulating layer made of a polyimide resin is formed over the substrate, the first conductor layer and the thick film resistor with through holes on the first conductor layer. Then, plating is applied to the whole surface of the insulating layer, the wall surfaces of the through holes and the exposed portions of the first conductor layer and etching is applied thereto with a predetermined pattern so that a second conductor layer is formed.

REFERENCES:
patent: 4119480 (1978-10-01), Nishi et al.
patent: 4211603 (1980-07-01), Reed
patent: 4347306 (1982-08-01), Takeda et al.
patent: 4424251 (1984-01-01), Sugishita et al.
patent: 4464420 (1984-08-01), Taguchi et al.
patent: 4487811 (1984-12-01), Eichelberger et al.
patent: 4547455 (1985-10-01), Hiramoto et al.

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