Method of manufacturing multi-layer thin film circuits containin

Details Method of manufacturing multi-layer thin film circuits containin Method of manufacturing multi-layer thin film circuits containin

1991-04-15

1993-07-13

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156655, 156656, 1566591, 1566611, 156652, 156668, 156901, 29620, 428209, 428901, B44C 122, B29C 3700, C23F 100

Patent

active

052270122

ABSTRACT:
In multi-layer thin film circuits, fabricated by alternate formation of conductor layers and insulating layers, there can be integrated thin film resistors which bear directly upon the substrate but nonetheless are not subjected, during manufacture, to the high temperatures of curing of the insulating layers and which then would be damaged. The manufacturing method also allows producing integrated electrical contacting between the thin film resistors and conductors of all of the conductor layers.

REFERENCES:
patent: 3726733 (1973-04-01), Nakamura et al.
patent: 4496435 (1985-01-01), Harada et al.
patent: 4752555 (1988-06-01), Takada et al.

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