Food or edible material: processes – compositions – and products – Direct application of electrical or wave energy to food... – Involving dielectric heating or passage of electric current...
Patent
1998-07-15
2000-05-16
Bhat, Nina
Food or edible material: processes, compositions, and products
Direct application of electrical or wave energy to food...
Involving dielectric heating or passage of electric current...
426245, 426440, 426447, 426448, 426512, 426559, A21D 600
Patent
active
060634227
DESCRIPTION:
BRIEF SUMMARY
TECHNICAL FIELD
The present invention relates to a method of manufacturing edible molded objects made of flour, etc.
BACKGROUND ART
An example of edible molded objects made of flour and other ingredients are molded baked snacks such as ice cream cones, monaka, wafers, etc. One method of manufacturing this kind of molded baked snack is the external heating method, in which the ingredients are placed into a mold previously heated to a predetermined temperature, and the snack is molded by heat conductivity.
However, with methods of this kind, slow molding leads to low productivity, and unevenness in the temperature of the mold causes uneven baking, thus making it impossible to obtain a uniform consistency when eaten, which varies from part to part.
For this reason, in another method, alternating current is supplied to a metal mold, and internal heating is induced in the ingredients in the mold by electromagnetic wave heating, such as resistance heating or dielectric heating, thereby baking and molding the ingredients. In this case, the metal mold is divided into two mold halves, which are insulated from each other by an insulating material provided therebetween, and an alternating current electrode is connected to each mold half. Then alternating current is applied to the metal mold through these electrodes, and the ingredients in the mold are baked and molded by resistance heating or dielectric heating.
However, with the foregoing method using resistance heating or dielectric heating, during molding, liquid contained in the ingredients evaporates, producing a large amount of vapor, which condenses, causing insulation breakdown, and thus resistance heating or dielectric heating does not go well.
DISCLOSURE OF THE INVENTION
The object of the present invention is to provide a method of manufacturing molded baked snacks capable of preventing insulation breakdown due to condensation of a large amount of vapor evaporating from the ingredients during heating and molding of the molded baked snacks by resistance heating or dielectric heating.
In order to attain the foregoing object, a first method of manufacturing molded baked snacks according to the present invention is a method of manufacturing molded baked snacks by placing ingredients in a mold made up of first and second conductive mold halves and an insulating section therebetween, and applying across both mold halves alternating current from an alternating current power source, thus heating and expanding the ingredients by means of resistance heating and/or dielectric heating, in which the insulating section of the mold is provided with a vapor release section, pressure is reduced outside the mold, and the heating is performed while releasing vapor produced thereby through the vapor release section.
During heating and molding of the molded baked snacks, a large amount of vapor is produced, and this vapor condenses in the vapor release section provided in the insulating section, causing insulation breakdown. However, with the foregoing method, by reducing pressure, condensation of the vapor is prevented. Consequently, insulation breakdown can be prevented.
A second method of manufacturing molded baked snacks is a method of manufacturing molded baked snacks by placing ingredients in a mold made up of first and second conductive mold halves and an insulating section therebetween, and applying across both mold halves alternating current from an alternating current power source, thus heating and expanding the ingredients by means of resistance heating and/or dielectric heating, in which the insulating section of the mold is provided with a vapor release section, the vapor release section is heated, and the heating of the ingredients is performed while releasing vapor produced thereby through the vapor release section.
During heating and molding of the molded baked snacks, a large amount of vapor is produced, and this vapor condenses in the vapor release section provided in the insulating section, causing insulation breakdown. However, with the foregoing meth
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patent: 5476600 (1995-12-01), Petelle et al.
patent: 5591491 (1997-01-01), Ando et al.
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Ando Sadamasa
Haruta Toshitaka
Karasawa Taizo
Kurisaka Takayuki
Oowada Tsutomu
Bhat Nina
Nissei Kabushiki Kaisha
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