Method of manufacturing microminiature solid state devices

Details Method of manufacturing microminiature solid state devices Method of manufacturing microminiature solid state devices

1979-01-31

1982-02-16

Godici, Nicholas P.

Metal working

Method of mechanical manufacture

Electrical device making

198381, H01R 4300

Patent

active

043153666

ABSTRACT:
A method for manufacturing microminiature solid state devices and apparatus for use in such a method. In various operations, e.g. wire-bonding and die-bonding it is essential to accurately orientate a header of the device. The header (1a) is mounted in a carrier strip (2) and is transported with approximately the desired orientation into the work area (6). Previous mechanical orientation techniques have caused both bending of the lead pins and adhesion between the header and the mechanical elements of the bonding machine. In this method, which is suitable for orientating devices with e.g. a T0.3, T0.5, T0.9 or T0.18 outline, magnetic attraction is used to pull two lead pins (12) against an abutment (14a) so that it becomes correctly orientated. The use of an electromagnet (7), which may be cooled using e.g. a nitrogen jet (17) or a water-cooling jacket (23), facilitates a periodic polarity reversal thus preventing any undesirable permanent magnetization.

REFERENCES:
patent: 3243036 (1966-03-01), Fegley
patent: 3390450 (1968-07-01), Checki, Jr. et al.
patent: 3494024 (1970-02-01), Bock et al.
patent: 3635730 (1972-01-01), Sweitzer
Western Electric Tech. Digest, No. 20, Oct. 1970, pp. 5-6.
Western Electric Tech. Digest, No. 23, Jul. 1971, p. 3.

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