Method of manufacturing micro-semiconductor element

Details Method of manufacturing micro-semiconductor element Method of manufacturing micro-semiconductor element

2005-03-29

2005-03-29

Pham, Hoai (Department: 2814)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

C438S106000

Reexamination Certificate

active

06872634

ABSTRACT:
A method of manufacturing a micro-semiconductor element comprising the following steps of: adhering a semiconductor wafer10having a circuit surface and a back surface to a support plate20via a protective film22so that the circuit surface faces to the protective film; reducing a thickness of the semiconductor wafer while the semiconductor wafer is supported by the support plate; dividing the semiconductor wafer into individual semiconductor elements10awhile the semiconductor wafer is adhered to the protective film; moving the semiconductor elements from the protective film to an adhesive peeling film26in such a manner that the back surfaces of the semiconductor elements are adhered to the peeling film; supporting a periphery of the peeling film by a support ring28; and picking up the individual semiconductor element by a pickup device when the back surface of semiconductor element is pushed up, via the peeling film, by a pushup pin30. An individual semiconductor element can also be picked up by an air suction nozzle36.

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