4. Land vehicles: bodies and tops
  5. Bodies
  6. Structural detail

Hoa B. Trinh

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Adhesive wafers for die attach application

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Anastomotic fitting

Surgery – Instruments – Surgical mesh – connector – clip – clamp or band
Reexamination Certificate

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Apparatus for applying cranial occipital pressure

Surgery – Instruments – External pressure applicator
Reexamination Certificate

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Automatic surgical device and control assembly for cutting a cor

Surgery – Instruments – Corneal cutter or guide for corneal cutter
Patent

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Barrier layers ferroelectric memory devices

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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Profile ID: LFUS-PAI-P-108526

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