Method of manufacturing micro electro mechanical systems device

Details Method of manufacturing micro electro mechanical systems device Method of manufacturing micro electro mechanical systems device

2011-07-05

2011-07-05

Le, Thao X (Department: 2892)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S048000, C438S052000, C310S329000, C073S488000, C073S514010, C257SE21022, C257SE21573, C257SE23193

Reexamination Certificate

active

07972886

ABSTRACT:
Provided is a MEMS device which is robust to the misalignment and does not require the double-side wafer processing in the manufacture of a MEMS device such as an angular velocity sensor, an acceleration sensor, a combined sensor or a micromirror. After preparing a substrate having a space therein, holes are formed in a device layer at positions where fixed components such as a fixing portion, a terminal portion and a base that are fixed to a supporting substrate are to be formed, and the holes are filled with a fixing material so that the fixing material reaches the supporting substrate, thereby fixing the device layer around the holes to the supporting substrate.

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