Method of manufacturing liner insulating layer

Details Method of manufacturing liner insulating layer Method of manufacturing liner insulating layer

1999-03-11

2000-12-05

Utech, Benjamin L.

Semiconductor device manufacturing: process

Chemical etching

Combined with coating step

438699, 438700, 438702, 438706, 438745, H01L 21302

Patent

active

061566640

ABSTRACT:
A method of manufacturing a liner insulating layer for a node contact hole. A substrate having an first insulating layer formed thereon is provided, wherein the first insulating layer has a node contact hole penetrating through the first insulating layer and exposing the substrate. A protective layer is formed on the substrate exposed by the node contact hole. A liner insulating layer is formed on the first insulating layer and in the node contact hole. A second insulating layer is formed on a portion of the liner insulating layer formed on the sidewall of the node contact hole. A portion of the liner insulating layer uncovered by the second insulating layer is removed. The protective layer and the second insulating layer are removed.

REFERENCES:
patent: 5376571 (1994-12-01), Bryant et al.
patent: 5414289 (1995-05-01), Fitch et al.
patent: 5677563 (1997-10-01), Cronin et al.
patent: 5731242 (1998-03-01), Parat et al.
patent: 5789316 (1998-08-01), Lu

Affiliated with

Also associated with

Rating

Method of manufacturing liner insulating layer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing liner insulating layer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing liner insulating layer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-961389