Method of manufacturing interconnect substrate

Details Method of manufacturing interconnect substrate Method of manufacturing interconnect substrate

2007-03-09

2009-02-10

Nhu, David (Department: 2895)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S678000, C257SE21590, C257SE21487, C257SE21492

Reexamination Certificate

active

07488678

ABSTRACT:
A method of manufacturing an interconnect substrate by electroless plating, including: (a) forming a catalyst layer with a specific pattern on a substrate; (b) immersing the substrate in a first electroless plating solution including a first metal to deposit the first metal on the catalyst layer to form a first metal layer; and (c) immersing the substrate in a second electroless plating solution including a second metal to deposit the second metal on the first metal layer to form a second metal layer, an ionization tendency of the first metal being higher than an ionization tendency of the second metal.

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