Method of manufacturing integrated circuit

Details Method of manufacturing integrated circuit Method of manufacturing integrated circuit

2005-08-30

2005-08-30

Duda, Kathleen (Department: 1756)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

C430S394000, C430S396000

Reexamination Certificate

active

06936406

ABSTRACT:
In order to shorten the period for the development and manufacture of a semiconductor integrated circuit device, at the time of transferring integrated circuit patterns onto a wafer by an exposure process, a photomask PM1is used which is provided partially with light shielding patterns3aformed of a resist film, in addition to light shielding patterns formed of a metal.

REFERENCES:
patent: 4684971 (1987-08-01), Payne
patent: 5376483 (1994-12-01), Rolfson
patent: 5378585 (1995-01-01), Watanabe
patent: 5389474 (1995-02-01), Iguchi et al.
patent: 5418092 (1995-05-01), Okamoto
patent: 5556724 (1996-09-01), Tarumoto et al.
patent: 5741613 (1998-04-01), Moon et al.
patent: 5948572 (1999-09-01), Liu et al.
patent: 5989760 (1999-11-01), Mangat et al.
patent: 6750000 (2004-06-01), Tanaka et al.
patent: 54-21272 (1979-02-01), None
patent: 54-83377 (1979-07-01), None
patent: 55-22864 (1980-02-01), None
patent: 56-30129 (1981-03-01), None
patent: 59-22050 (1984-02-01), None
patent: 60-85525 (1985-05-01), None
patent: 63-274156 (1988-11-01), None
patent: 4-97254 (1992-03-01), None
patent: 4-136854 (1992-05-01), None
patent: 5-289307 (1993-11-01), None
patent: 7-325383 (1995-12-01), None
patent: 2000-21754 (2000-01-01), None

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