Method of manufacturing integrated circuit

Details Method of manufacturing integrated circuit Method of manufacturing integrated circuit

2005-10-25

2005-10-25

Guerrero, Maria F. (Department: 2822)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S669000, C438S942000, C438S945000, C438S948000, C438S950000

Reexamination Certificate

active

06958292

ABSTRACT:
In order to shorten the period for the development and manufacture of a semiconductor integrated circuit device, at the time of transferring integrated circuit patterns onto a wafer by an exposure process, a photomask PM1is used which is provided partially with light shielding patterns3aformed of a resist film, in addition to light shielding patterns formed of a metal.

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