Method of manufacturing inspection unit

Details Method of manufacturing inspection unit Method of manufacturing inspection unit

2007-10-16

2007-10-16

Estrada, Michelle (Department: 2823)

Semiconductor device manufacturing: process

With measuring or testing

Electrical characteristic sensed

C438S017000, C324S754090, C257S048000, C257SE21521, C257SE21524

Reexamination Certificate

active

11259054

ABSTRACT:
A conductive member having a first face adapted to be mounted on a board on which an inspection circuit is arranged, and a second face adapted to be opposed to a device to be inspected is prepared. The conductive member is formed with a first through hole having a first diameter and communicating the first face with the second face. A contact probe including a tubular body having a second diameter which is smaller than the first diameter, and a plunger retractably projected from one end portion of the tubular body is prepared and disposed in the first through hole. A conductive plate having a second through hole is prepared. Molten resin is injected into the second through hole such that at least a part of inner face of the second through hole is covered with solidified resin, thereby forming a third through hole. The conductive plate is disposed so as to oppose to the second face of the conductive member and to communicate the third through hole with the first through hole. The solidified resin is brought into contact with at least the one end portion of the tubular body so as to coaxially retain the contact probe in the first through hole while only the plunger is projected from the conductive plate.

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