Method of manufacturing high density fine line printed circuitry

Details Method of manufacturing high density fine line printed circuitry Method of manufacturing high density fine line printed circuitry

1977-01-11

1979-06-26

Massie, Jerome W.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156631, 156645, 156902, 156153, 156233, 156249, 156289, 204 15, 204 23, 204 32R, 204 38E, 427 96, 427264, 427282, 427409, H05K 312

Patent

active

041592220

ABSTRACT:
The method of manufacturing printed circuitry with sufficiently high resolution to permit line densities of at least 1 mil lines on 3 mil centers includes the steps of placing a thickness of dry film photoresist on a smooth, polished substrate or carrier optionally, applying a thin lubricating layer of spray wax to the exposed surface of the photoresist, wringing a mask defining a desired conductive circuit pattern into high integrity, intimate contact with the surface of the resist, exposing and developing the resist to remove the resist from the smooth surface in regions where the conductive circuit pattern is to be formed, electroplating the conductors within the voids formed in the resist; removing all remaining resist, laminating a flowable dielectric material to the smooth surface of the substrate and the conductive circuit pattern, and removing the laminate material and conductive circuit pattern from the smooth surface. If desired, conductive via interconnects can be selectively formed and additional layers of circuit patterns can be formed atop the first high resolution layer.

REFERENCES:
patent: 2254429 (1941-09-01), Kreutzer
patent: 2387631 (1945-10-01), Weir
patent: 2728693 (1955-12-01), Cado
patent: 2748048 (1956-05-01), Russell
patent: 3152938 (1964-10-01), Osifchin et al.
patent: 3181986 (1965-05-01), Pritkin
patent: 3791858 (1974-02-01), McPherson et al.
patent: 3871930 (1975-03-01), Fish
patent: 3947957 (1976-04-01), Luttmer
patent: 3990926 (1976-11-01), Konicek
Lyman, J., "Flexible Circuits . . . Will", Electronics, Sep. 1977, (pp. 98-105).
An Introduction to Photo Fabrication Using KODAK Photosensitive Resists, Eastman Kodak Co., Rochester, N.Y., p. 22.

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